Supplier briefing · Request for quotation and DFM

Brainwave v3 Enclosure

One aluminium enclosure in three anodised colours for an on-prem AI desktop server. Drawing set rev C.

Al 6061-T6 on all tiers. Silver, Copper, Gold are anodise colours only. Brainwave · BangkokRev C · 2026-11-03

02 · Product overview

Three tiers, one enclosure

Brainwave is an on-prem AI desktop server designed in Bangkok. All three tiers share the same exterior parts and the same base material. Only the anodise colour and a few interior brackets change.

Tier	Compute	Exterior finish	Board plate	PSU	Heat (est.)	Mass (est.)
Silver	NVIDIA RTX Spark N1X (Grace), 128 GB	Silver (clear anodise)	BW3-210 mini-ITX	SF750	192 W	10.2 kg
Copper	Ryzen 7 9700X + RTX PRO 4000 Blackwell	Copper colour anodise	BW3-211 deep mini-ITX	SF750	307 W	12.2 kg
Gold	Ryzen 9 9950X (120 W cap) + RTX PRO 6000 Max-Q 300 W	Gold colour (champagne) anodise	BW3-211 deep mini-ITX	SF1000	576 W	12.8 kg

Mass includes components. Enclosure parts only: Silver 7.7 kg, Copper 7.8 kg, Gold 7.8 kg (sheet 3). Source: drawing sheet 23 tier matrix.

Quantity and budget

To be confirmed

Order quantity and target budget are not decided yet. Please quote by quantity tier, for example:

Prototype (first article, per colour)
Small batch
Larger batch at the quantity break you recommend

Scope of this request

Made parts in the BOM (sheet 3, 40 lines): shell sleeve, top cap and twist latch, plinth and base, interior sheet-metal frame, finishing, PEM install. Please state which standard hardware you can also source.

Brainwave v3 enclosure · Supplier briefing · Rev C

03 · Overall dimensions

196 × 341 × 400 mm envelope

W × D × H

196 × 341 × 400mm

Over fin tips and smooth bands

Core between fins185.6 × 330.6 mm, corners R12.8
Height zones (z from desk)Plinth 0..15 · lower body 15..125 · rib band 125..336 · top cap 336..400
Fins21 fins, 4.8 thick, pitch 10.0, depth 5.2, z 128..338
Topd124 grip bowl with twist latch
Mass incl. components (est.)Silver 10.2 · Copper 12.2 · Gold 12.8 kg

Units mm, 3rd angle projection, general tolerance ISO 2768-mK.

Sheet 2, general assembly: front, right, rear, top. Click to enlarge.

Brainwave v3 enclosure · Supplier briefing · Rev C

04 · Parts list

40 BOM lines, one shell for all tiers

P/N	Part	Size / thickness (mm)	Material	Qty	Tier	g
Exterior and sleeve
BW3-100	Shell sleeve (101 + 102 + 103 bonded)	assembly	Al 6061-T6	1	S/C/G	-
BW3-101	Lower body, smooth band, rear I/O	196 × 341, z15..125, wall 3.0	Al 6061-T6	1	S/C/G	994
BW3-102	Rib band, 21 fins, 80 hidden slits	196 × 341, z125..336, core 3.0	Al 6061-T6	1	S/C/G	2594
BW3-103	Top cap with carry grip	196 × 341, z336..400, d124	Al 6061-T6	1	S/C/G	1214
BW3-104	Logo window, PC half-disc	R43.85 × 3.5	PC Lexan 9034	1	S/C/G	13
BW3-105	Plinth, perforated slanted tray	166 × 311, t1.0	Al 6061 T4>T6	1	S/C/G	173
BW3-106	Base plate	t3.0	Al 6061-T6 plate	1	S/C/G	394
BW3-107	Foot ring	sheet 14	Al 6061-T6	1	S/C/G	11
BW3-108	Foot strip, silicone	2.0 × 1.5 × 760	Silicone 50A	1	S/C/G	2
BW3-110	Power button cap	d11	Al 6061-T6	1	S/C/G	2
BW3-111	Intake filter	d140	PET mesh 80 µm	1	S/C/G	6
BW3-112	Sleeve base seal	EPDM sponge 1.2	EPDM	1	S/C/G	-
BW3-115	Vent liner, side, perforated	302 × 199 × 0.3	SS304	2	S/C/G	18
BW3-116	Vent liner, front, solid	154 × 199 × 0.3	SS304	1	S/C/G	9
BW3-117	Vent liner, rear, perforated	154 × 199 × 0.3	SS304	1	S/C/G	9
BW3-118	Sleeve lead-in guide	4.4 × 24 × 22	POM-C	4	S/C/G	3
BW3-119	Sleeve dowel ISO 8734	4 × 12	Steel, hardened	4	S/C/G	1

P/N	Part	Size / thickness (mm)	Material	Qty	Tier	g
Top cap twist latch
BW3-301	Latch knob spider	d96	Al 6061-T6	1	S/C/G	31
BW3-302	Half-moon flip tab	R43.85 × 3.5	PA66-GF30	1	S/C/G	14
BW3-303	Latch shaft	d8 × 25, head d12	17-4PH H1025	1	S/C/G	11
BW3-304	Bayonet cross pin	ISO 8734 4 × 20	Steel, hardened	1	S/C/G	2
BW3-305	Latch receiver plate	90.5 × 50 × 5	Al 6061-T6	1	S/C/G	59
BW3-306	Cam ring, 2 ramps	OD36 × 6	17-4PH H900	1	S/C/G	42
BW3-307	Knob retainer, 2 arms	t2.2	POM-C	1	S/C/G	3
BW3-308	Antenna carrier	sheet 11	POM-C	2	S/C/G	2
Interior frame (sheet metal)
BW3-201	Base tray	t2.0	6061 T4>T6	1	S/C/G	232
BW3-202	Sea wall, front	t3.0, flat 381.8 × 177.6	6061 T4>T6	1	S/C/G	505
BW3-203	Sea wall, rear	t3.0, flat 381.8 × 177.6	6061 T4>T6	1	S/C/G	506
BW3-204	Frame top rail	12 × 14 × 180 bar	6061-T6	2	S/C/G	78
BW3-206	Rail saddle	t3.0, flat 33.3 × 90	6061 T4>T6	2	S/C/G	23
BW3-207	Hot deck, 3 pieces	t1.5, flat	6061 T4>T6	1	S/C/G	191
BW3-210	Board plate, mini-ITX	t3.0, flat 238.8 × 172	6061 T4>T6	1	S	332
BW3-211	Board plate, deep mini-ITX	t3.0, flat 238.8 × 172	6061 T4>T6	1	C/G	332
BW3-240	GPU top bracket	t2.0, flat 66.6 × 120	6061 T4>T6	1	C/G	27
BW3-241C	GPU tail rest, Copper	t2.0, flat 65.4 × 121.2	6061 T4>T6	1	C	43
BW3-241G	GPU tail rest, Gold	t2.0, flat 82.8 × 121.2	6061 T4>T6	1	G	54
BW3-250	SFX-L PSU hanger	t2.0, flat 97.1 × 125	6061 T4>T6	1	S/C/G	41
BW3-251	PSU foam block	PU 30 kg/m³	PU foam	1	S/C/G	4
BW3-270	Cable channel	t1.0, flat 33.6 × 316.6	6061 T4>T6	1	S/C/G	29
BW3-280	Rear I/O bracket	t1.5, flat 43.4 × 40	6061 T4>T6	1	S/C/G	6

Source: sheet 3 BOM, sheets 5 to 21 for sizes. g = estimated mass per BOM line from sheet 3. Hardware (screws, PEM, dowels) on sheet 4. S/C/G = Silver / Copper / Gold.

Brainwave v3 enclosure · Supplier briefing · Rev C

05 · Material and process

Aluminium 6061-T6, machined shell, formed frame

Material

Al 6061-T6

All tiers, shell and interior. Interior sheet is formed in T4 and aged to T6. No copper, gold or other precious metal is used anywhere.

Wall thickness (mm)

BW3-101	lower body wall	3.0 ±0.1, R15 inner corner
BW3-102	core wall / fins	3.0 / 4.8 ±0.05
BW3-103	knob pocket floor web	3.0
BW3-106	base plate	3.0
202 / 203 / 206 / 210 / 211	sea walls, saddle, board plates	3.0
201 / 240 / 241 / 250	tray, GPU, PSU brackets	2.0
207 / 280	hot deck, I/O bracket	1.5
105 / 270	plinth, cable channel	1.0
115 / 116 / 117	vent liners (SS304)	0.3

Edges break 0.2 to 0.4 unless stated. Surface Ra 1.6 unless stated.

Proposed process (open to your proposal)

Shell 101 / 102 / 103
CNC from 6061-T6 billet or plate, 3-axis plus 4th axis for side operations. Slits cut with a d4 end mill from outside at the groove floor.
Sleeve BW3-100
101, 102, 103 bonded with 3M DP490 plus dowels at the seams. One-piece machining is an open option: your advice please.
Interior sheet metal
Laser cut, bend in T4, age to T6 (AMS 2770), K 0.45, inside R = t. Chem film, then PEM install.
Plinth BW3-105
Perforated 1.0 sheet, bent, corners fibre-laser welded and ground flush, black anodise.
Latch and small parts
17-4PH turned parts (H900 / H1025), PA66-GF30 tab with MT-11010 texture, POM-C, photo-etched SS304 liners with black e-coat.

Brainwave v3 enclosure · Supplier briefing · Rev C

06 · Anodise finish

Silver, Copper, Gold: colour only

Silver

Clear anodise

Copper

Dyed copper colour

Gold

Dyed champagne gold

Anodise specification (sheet 24)

ProcessMIL-A-8625 Type II Class 2 (dyed), sulphuric acid
Pre-treatBead-blast #120 glass, uniform matte, etch-free deox (no caustic etch)
Thickness and seal10 to 18 µm, hot-sealed nickel acetate, seal test ASTM B136
Colour matchMatch master samples, ΔE ≤ 1.5 CIELAB, D65 10°
Batch101, 102, 103 of one unit in the same tank batch, racked in the same orientation
MaskingSeam spigots (EMI path), M4 threads, ground lug pad, PEM bores
Black parts and interior105 plinth, 106 base plate: Type II black. Interior sheet: chem film MIL-DTL-5541 Type II Class 3, clear.
Cosmetic classesA exterior visible, B rear and plinth, C interior. Rack marks on class C only. Inspect at 1000 lux, 450 mm.

Brainwave v3 enclosure · Supplier briefing · Rev C

07 · Rib band BW3-102

Exhaust hidden in the groove bottoms

Render and sheet 7 (click to enlarge)

Fins21 fins, 4.8 ±0.05 thick, pitch 10.0 ±0.05 non-accumulating, groove depth 5.2. Fin rings tie to the core at the 4 corner radii only.
Hidden slits80 slits, 4.0 +0.1/0 wide, ends R2, through the 3.0 core wall at the groove floor, one per groove on all 4 faces, so every groove reads the same dark.
Slit tableSides: 40 × 300 long · rear: 20 × 152 · front: 20 × 152, blind (solid liner). Total cut 723.2 cm².
Open exhaustSide rows 12..19 and rear rows 14..19 open: 228.5 cm² cut, 163.8 cm² free behind the liner (71.7 %).
Liners 115 / 116 / 117SS304 0.3, photo-etched hex d2.0 on 2.4 pitch, matte black e-coat, bonded with 3M VHB 9469 on solid lands. Dust and EMI screen; lifts off with the sleeve.
SeamsTongue 1.5 at both ends into rebates in 101 / 103, spigot fit H8/f7, exterior step max 0.05, gap 0.10 +0.05/0.

Brainwave v3 enclosure · Supplier briefing · Rev C

08 · Top cap BW3-103 and twist latch

Flip, turn 90°, lift the whole shell

Logo disc and grip render · sheet 10 section A-A

Flip up the white half-moon tab BW3-302 (PA66-GF30). It becomes the handle.
Turn 90° CCW. The cross pin leaves the cam notches (2 ramps 1.5 / 90°, 17-4PH H900).
Lift: the whole sleeve 101 + 102 + 103 (about 3.3 kg) comes off. Frame, electronics, I/O and base stay on the desk.
Interlock: Omron D2F-01F in series with PS_ON opens on the first 0.5 mm of lift. No sleeve, no power.

Lift load path, 258 N design loadTab > pins > spider > shaft > cross pin > cam > receiver > 4x M4 > rails > 4x M5 > saddles > sea walls > tray. Load goes into the frame, not the shell.
Logo discPC Lexan 9034 RF-transparent window R43.85 × 3.5, back-painted, on spider d96 (Al 6061-T6, tier anodise). Front wordmark etched 0.1 deep after anodise.
Latch materials17-4PH shaft and cam, PA66-GF30 tab, POM-C retainer and guides, wave spring 40 N preload.

Brainwave v3 enclosure · Supplier briefing · Rev C

09 · Rear and base

IEC inlet, power button, slanted grille plinth

Rear render · sheet 6 rear I/O 1:1

Rear cut-outs in BW3-101 (sheet 6)

Feature	X	Z	Size (mm), tol +0.1/0
IEC inlet	0	34	C6 (Silver) · C14 27.8 × 20.0 (Copper / Gold)
Power button	-47	34	d11.6 +0.1/0, cap d11
USB-C 1	47	30	9.2 × 3.6
USB-C 2	47	39	9.2 × 3.6
RJ45	70	36	16.3 × 14.0

Connectors mount on frame bracket BW3-280; sleeve cut-outs clear them by +0.5 all round. Front is sealed, no openings.

Plinth BW3-105Al 6061 1.0, perforated d2.0 on 3.0 hex (40.3 % open), walls slanted 27.55°, flange 166 × 311 with 8x M3, laser-welded corners, black anodise.
AirflowIntake from the bottom: plinth perforation > filter BW3-111 (PET 80 µm) > d132 base opening. Exhaust: upper sides and rear slits.

Brainwave v3 enclosure · Supplier briefing · Rev C

10 · Interior frame

Sheet-metal frame, mount points, tolerances

Sheet 22 interior assembly (Gold). Frame part sheets 16 to 21 in the appendix.

Frame parts

Base plate 106 (3.0) and tray 201 (2.0)
Sea walls 202 / 203 (3.0), with hot deck 207 form the CPU duct
Saddles 206 + top rails 204 carry the latch receiver
Board plates 210 (S) / 211 (C, G)
GPU bracket 240, tail rests 241C / 241G
PSU hanger 250 (SF750 / SF1000 Gold), cable channel 270, I/O bracket 280

Mount points

2x Noctua NF-A14x25 G2 on 4x NA-AV2 each, holes d4.5 on 124.5 ±0.2 square (tray and hot deck)
Board: PEM SO-632-8 standoffs, TP 0.2 to ITX spec, 0.6 Nm
CPU cooler Noctua NH-U12A (Copper, Gold)
SFX-L PSU: 4x #6-32 into 250, foam 251
PEM: 27x S-M4-2, 4x S-M3-1, 4x CLS-M5-1, installed after chem film

Key tolerances (sheet 24)

General	ISO 2768-mK machined, ISO 2768-m sheet, ISO 13920-B weld
Datums	A base face of 101 flatness 0.05 · B rear face ⟂ A 0.05 · C centre plane
Sleeve locate	4 dowels d4 m6 in N7, sockets d4.1 H8 × 7, TP 0.05
Sheet bends	Angle ±0.5°, flange ±0.15, flats per DXF; PEM holes +0.08/0

Brainwave v3 enclosure · Supplier briefing · Rev C

10 · Interior: simulation

Thermal and structural check, all tiers pass

Reduced-order models, to be confirmed on the prototype. GPU die temperature was not simulated directly.

Tier	Fan rpm	dBA	CPU Tj at 25 °C	CPU Tj at 35 °C
Silver	1150	22.0	68.2 °C	75.0 °C	Pass
Copper	770	13.3	51.7 °C	61.7 °C	Pass
Gold	1370	25.8	58.4 °C	68.4 °C	Pass

Limits: Tj 95 °C, and 85 °C at 35 °C room. Fan rpm and dBA at the 25 °C design point. Heat load 192 / 307 / 576 W.

Gold, airflow and air temperature, mid section

Frame, lift load 258 N

20.8SF

Peak 13.3 MPa, max displacement 0.03 mm

Latch knob spider BW3-301

2.4SF

Peak 114 MPa, max displacement 0.31 mm

Linear static FEA, voxel mesh, load 258 N (2x Gold mass). Click any plot to enlarge.

Brainwave v3 enclosure · Supplier briefing · Rev C

11 · Attached files

Download the full data package

STEP is the master geometry for CNC. Drawings control tolerances, threads, finish and inspection.

PDF · 2.2 MBDrawing set rev C25 A3 sheets: GA, BOM, hardware and torques, part drawings, latch, interior, tier matrix, tolerances and anodise spec, open items.Download PDF ↓ STEP · ZIP · 16.5 MB3D models43 STEP files: 3 tier assemblies (BW3-000 silver, copper, gold) and one file per part BW3-101 to BW3-308.Download STEP zip ↓ DXF · ZIP · 0.2 MBFlat patterns and profiles19 DXF files for sheet-metal flats and 2D profiles. Layers OUTLINE, HOLES, BEND, BEND_ZONE, PERF, TEXT. K 0.45, inside R = t; confirm with your bend test.Download DXF zip ↓

Every sheet is also in the appendix of this deck as a high-resolution imageGo to appendix →

Brainwave v3 enclosure · Supplier briefing · Rev C

12 · Questions for the supplier

What we would like in your reply

Process. Your recommended process for the shell (CNC billet vs. extrusion plus machining vs. other) and for the sleeve (bonded 3 parts vs. one-piece).
Prototype price. Price for a prototype set, per colour, including finish.
Price by quantity. Unit price at the quantity breaks you propose (for example small batch and larger batch), plus tooling or fixture cost and MOQ.
Lead time. For first articles and for batch production, including anodise.
DFM feedback. Any feature that drives cost or risk: fins and hidden slits, R12.8 corners, thin 3.0 walls, perforated plinth weld, tolerances.
Anodise. Can you make Silver, Copper and Gold master colour samples and hold ΔE ≤ 1.5 across parts and batches?
Sheet metal. Confirm bend R = t in 6061 formed in T4 then aged, availability of perforated 6061 stock for BW3-105, and PEM sourcing.
Scope. Which bought-in latch parts and hardware (sheet 4) you can source, and which inspection reports you provide.

Please quote

Prototype
Small batch
Larger batch, your recommended break

Quantity and budget are not decided yet.

Open items

The drawing set has 16 open items (sheet 25). Your input on the ones marked mechanical and purchasing is welcome. See the next slide.

Contact: Brainwave, Bangkok.

Brainwave v3 enclosure · Supplier briefing · Rev C

12 · Open items from sheet 25

16 items not fully specified yet

#	Item	Description	Owner
01	IEC inlet	C6 is 2.5 A; Copper / Gold need C14 (10 A). Final P/N and cut-out TBD	electrical
02	Exhaust area	163.8 cm² free behind liner; CFD OK (Gold Tj 58 °C); confirm with prototype smoke test	thermal
03	Detent code	MISUMI C-BPK3 and Smalley CM12-M5 wave spring codes to confirm	purchasing
04	Hard stop	Latch end stop and ramp profile not modelled in 3D; define on cam BW3-306	mechanical
05	Tab	Held flat by gravity + detent only; consider a small magnet or spring	design
06	BW3-211	Deep mini-ITX hole pattern is placeholder until board P/N is fixed	mechanical
07	Connectors	Switch, USB-C, RJ45 keystone, IEC P/N TBD; cables unplugged before lift	purchasing
08	GPU	GPU bracket screw positions TBD with sample card	mechanical
09	CLS-M5	Hole size for PEM CLS-M5 to verify vs bulletin	mechanical
10	Silver	No fin duct: air may bypass the fin stack; add duct if prototype shows it	thermal
11	BW3-207	Hot deck is 3 pieces; fixing tabs / screws not yet modelled	mechanical
12	Sleeve bond	DP490 + dowels at seams vs one-piece machining; band stiffness of thin 101 wall to check	mechanical
13	Riser	PCIe x16 riser cable P/N and routing open	purchasing
14	Silver board	N1X board mechanical data pending; BW3-210 uses mini-ITX	mechanical
15	Antennas	Deep spokes 0/180 pass close to the antennas; RF test needed	electrical
16	6061 sheet	Confirm bend R = t and perforated 6061 stock for BW3-105 with the fabricator	purchasing

Items 9, 12 and 16 are where your process knowledge helps most.

Brainwave v3 enclosure · Supplier briefing · Rev C

Appendix

Drawing set rev C, all 25 sheets

One sheet per slide. Click a drawing to view it full screen, click again for 100 % zoom, or open the full-resolution PNG.

01Index and general notes 02General assembly, exterior, overall dimensions 03Exploded view, BOM, material and finish per part 04Hardware BOM, PEM table, torques 05BW3-101 lower body 06BW3-101 rear I/O detail 1:1 07BW3-102 rib band, hidden groove slits 08BW3-115 / 116 / 117 vent liners 09BW3-103 top cap with carry grip 10Twist latch section A-A, B-B 11Latch parts BW3-301 .. 308 12Sleeve lift-off architecture, interfaces 13Airflow section x = 0 (Gold)14Small parts 104, 110, 107, 108, 111, 112, 118, 119, 251 15BW3-105 plinth, perforated, with flat 16BW3-106 base plate, BW3-201 tray 17BW3-202 / 203 sea walls with flats 18BW3-206 saddle, BW3-204 rail, BW3-207 hot deck 19BW3-210 / 211 board plates with ITX tables 20BW3-240 GPU bracket, BW3-241 tail rests 21BW3-250 PSU hanger, BW3-270 cable channel, BW3-280 I/O bracket 22Interior assembly (Gold), fan mounts, standoffs 23Tier configuration Silver / Copper / Gold 24Tolerances, fits, datums, anodise spec, cosmetic classes 25Open items (16)

Brainwave v3 enclosure · Supplier briefing · Rev C

Appendix · Sheet 01 / 25

Index and general notes

Full-res PNG PDF p.1

Brainwave v3 enclosure · Supplier briefing · Rev C

Appendix · Sheet 02 / 25

General assembly, exterior, overall dimensions

Full-res PNG PDF p.2

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Appendix · Sheet 03 / 25

Exploded view, BOM, material and finish per part

Full-res PNG PDF p.3

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Appendix · Sheet 04 / 25

Hardware BOM, PEM table, torques

Full-res PNG PDF p.4

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Appendix · Sheet 05 / 25

BW3-101 lower body

Full-res PNG PDF p.5

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Appendix · Sheet 06 / 25

BW3-101 rear I/O detail 1:1

Full-res PNG PDF p.6

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Appendix · Sheet 07 / 25

BW3-102 rib band, hidden groove slits

Full-res PNG PDF p.7

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Appendix · Sheet 08 / 25

BW3-115 / 116 / 117 vent liners

Full-res PNG PDF p.8

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Appendix · Sheet 09 / 25

BW3-103 top cap with carry grip

Full-res PNG PDF p.9

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Appendix · Sheet 10 / 25

Twist latch section A-A, B-B

Full-res PNG PDF p.10

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Appendix · Sheet 11 / 25

Latch parts BW3-301 .. 308

Full-res PNG PDF p.11

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Appendix · Sheet 12 / 25

Sleeve lift-off architecture, interfaces

Full-res PNG PDF p.12

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Appendix · Sheet 13 / 25

Airflow section x = 0 (Gold)

Full-res PNG PDF p.13

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Appendix · Sheet 14 / 25

Small parts 104, 110, 107, 108, 111, 112, 118, 119, 251

Full-res PNG PDF p.14

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Appendix · Sheet 15 / 25

BW3-105 plinth, perforated, with flat

Full-res PNG PDF p.15

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Appendix · Sheet 16 / 25

BW3-106 base plate, BW3-201 tray

Full-res PNG PDF p.16

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Appendix · Sheet 17 / 25

BW3-202 / 203 sea walls with flats

Full-res PNG PDF p.17

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Appendix · Sheet 18 / 25

BW3-206 saddle, BW3-204 rail, BW3-207 hot deck

Full-res PNG PDF p.18

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Appendix · Sheet 19 / 25

BW3-210 / 211 board plates with ITX tables

Full-res PNG PDF p.19

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Appendix · Sheet 20 / 25

BW3-240 GPU bracket, BW3-241 tail rests

Full-res PNG PDF p.20

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Appendix · Sheet 21 / 25

BW3-250 PSU hanger, BW3-270 cable channel, BW3-280 I/O bracket

Full-res PNG PDF p.21

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Appendix · Sheet 22 / 25

Interior assembly (Gold), fan mounts, standoffs

Full-res PNG PDF p.22

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Appendix · Sheet 23 / 25

Tier configuration Silver / Copper / Gold

Full-res PNG PDF p.23

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Appendix · Sheet 24 / 25

Tolerances, fits, datums, anodise spec, cosmetic classes

Full-res PNG PDF p.24

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Appendix · Sheet 25 / 25

Open items (16)

Full-res PNG PDF p.25

Brainwave v3 enclosure · Supplier briefing · Rev C